Wednesday, 8 June 2011
The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new console. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.
The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems.
Built on the open, scalable Power Architecture base, IBM custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology. The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability – from entertainment consoles to supercomputers.
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